- Product Description
-
Overview ：
MX300C The Thermal Characteristics Test System Of Power Devices Is An Automatic Thermal Characteristics Test Equipment, Which Is Composed Of A Data Acquisition Unit, A Temperature Control Unit, A Power Supply Unit And A Control Unit.
Features:
● High Test Accuracy, Heating Current To Remove The Speed Block
● "Real-Time" Structural Function Diagnosis: It Can Quickly Obtain The Results Of Fault Progress, Cycle Times, Fault Causes, Etc., And Automatically Stop The Test
● Perfect Protection Mechanism, With Multiple Protections Such As Power Failure, Over-Temperature, Smoke And Coolant Leakage Detection
● Compatible With Si/Sic/Gan Materials Igbt, Mosfet, Diode And Other Power Device Testing
● The Auxiliary Control System Of The Equipment Adopts Ups Power Supply, And The Safety Status Of The Equipment Can Still Be Indicated In The Power-Off State
● The Equipment Has The Ability To Test To Packaging Devices, Supports Minute-Level And Second-Level Power Cycles, And The Minimum Ton Can Be Set To 0.5s
● Three Experimental Channels, Up To 12 Stations, Each Station Grid Voltage -30v~ 30v Independent Control
● The Flow Rate Of The Three Experimental Channels Is Controlled Independently, And A Water Inlet And Outlet Are Reserved To Support The Experiment Of External Water Cooling Plate
● Optional Function: Optional Finite Element Simulation Analysis Software. Based On The Power Cycle Test Condition, The Transient Thermal Impedance Test Capability Of The Power Device Structure Such As Fatigue Aging, Life Analysis And Correction Is Carried Out
● Optional Function: Optional Structural Function Analysis Software, Structural Function Curve Display
Product Applications：
It Is Mainly Used For Power Cycling Testing And Thermal Characterization Testing Of Power Electronic Devices Such As Igbts To Simulate And Measure The Performance Of Power Electronic Devices During Their Lifetime. This Includes Power Cycling Testing And Thermal Resistance Testing. Refer To The Standard Aqg324 Reliability Test Standard For Automotive-Grade Power Modules, Mil-Std-750e Semiconductor Device Test Method, Gb13869-2008 Electrical Safety Guidelines, Gb19517-2004 National Electrical Equipment Safety Technical Specifications, Etc.
Product Inquiry
If you have any questions or needs, please leave a message or contact us, and we will reply to you as soon as possible.
Contact Us
Room B402, No. 100, Lane 4088, Luoshan Road, Beicai Town, Pudong New Area, Shanghai